4 Layer ENIG RO4003+AD255 Mixta Lamination PCB
RO4003C Rogers High Frequency PCB Materials
Materia RO4003C cum penicillo conventionali nylon amoveri potest.Nulla specialis tractatio ante electroplatandi aeris sine electricitate requiritur.Patina tractanda est utens processu conventionali epoxy/vitrei.In genere, non necesse est borehole removere, quia ratio resinae altae TG (280°C+[536°F]) non facile per artem processum decolorat.Si macula causatur ab operatione pugnax EXERCITATIO, resina removeri potest utente signo cycli plasmatis CF4/O2 vel per processum duplicem alkaline permanganatum.
Superficies materialis RO4003C mechanice et/vel chemica ad praesidium leve praeparata esse potest.Commendatur ut vexillum aqueum vel semi-aqueum photorestis.Quaelibet commercium aeris deletorium promptum adhiberi potest.Omnes columellae vel photographicae larvae solidabiles communiter adhibitae pro epoxy/vitri laminarum superficiei ro4003C optime adhaerent.Mechanica purgatio superficierum dielectricarum expositarum prior ad applicationem larvarum glutino et designatae superficies "descriptae" optimam adhaesionem vitabunt.
Coctura requisita materiae ro4000 aequipollent illis epoxy/vitri.Fere, apparatum qui epoxy non coquet/lamellae vitreae non indiget ro4003 laminis coquere.Ad institutionem epoxy/cocti vitrei ut pars processus conventionalis, commendamus coctionem 300°F, 250°f (121°c-149°C) pro 1 ad 2 horas.Ro4003C flammam retardat non continet.Intelligi potest laminam in infrared (IR) unitam vel operantem velocitate transmissionis ima redactam posse ad calores in excessu 700° f (371°C) perventuros;Combustio Ro4003C in his calidis temperaturis incipere potest.Systema, quae adhuc refluxus ultrarubrum utuntur machinis vel alio instrumento, qui ad has temperaturas altas pervenire potest, necessarias cautiones adhibeant ut nullum periculum sit.
Summus frequentia laminarum indefinite in cella temperie (55-85°F, 13-30°C), humiditas condi potest.Ad locus temperatus, materiae dielectricae in alta humiditate pigrae sunt.Sed metallum coatings ut aes oxidize potest altae humiditatis expositae.Vulgata prae-purgatio PCBS ex materiae proprie conditis corrosionem facile removere potest.
Materia RO4003C machinari potest utens instrumenta typice adhibita ad condiciones metallicas epoxy/vitrei et durae.Claua aeris a duce canali ne inlinitur removenda est.
Rogers RO4350B/RO4003C Material Parameters
| Properties | RO4003C | RO4350B | Directio | Unitas | Conditio | Test Methodi |
| Dk(ε) | 3.38±0.05 | 3.48±0.05 | - | 10 GHz/23℃ | IPC.TM.6502.5.5.5Fibulae microstrip linea test | |
| Dk(ε) | 3.55 | 3.66 | Z | - | 8 ad 40GHz | Differentia pars longitudinis modus |
| Damnum factor (tan δ) | 0.00270.0021 | 0.00370.0031 | - | 10GHz/23℃2.5 GHz/23℃ | IPC.TM.6502.5.5.5 | |
| Temperatus coefficiens ofdielectric constant | +40 | +50 | Z | ppm/ | 50℃ ad 150℃ | IPC.TM.6502.5.5.5 |
| Volumen Resistentia | 1.7X100 | 1.2X1010 | MΩ.cm | COND A | IPC.TM.6502.5.17.1 | |
| Superficies Resistentia | 4.2X100 | 5.7X109 | MΩ | 0.51mm(0.0200) | IPC.TM.6502.5.17.1 | |
| Patientia electrica | 31.2780） | 31.2780） | Z | KV/mm(V/mil) | RT | IPC.TM.6502.5.6.2 |
| Modulus distrahens | 19650（2850）19450（2821） | 16767（2432）14153（2053） | XY | MPa(kpsi) | RT | ASTM D638 |
| Distrahentes fortitudo | 139（20.2）100（14.5） | 203（29.5）130（18.9） | XY | MPa(kpsi) | ASTM D638 | |
| inflexio Fortitudo | 27640） | 25537） | MPa(kpsi) | IPC.TM.6502.4.4 | ||
| Dimensional Stability | 0.3 | 0.5 | X, Y | mm/m*(mils/inch) | Post engraving+E2/150℃ | IPC.TM.6502.4.39A |
| CTE | 111446 | 101232 | XYZ | ppm/ | 55 ad 288℃ | IPC.TM.6502.4.41 |
| Tg | ＞280 | ＞280 | DSC | A | IPC.TM.6502.4.24 | |
| Td | 425 | 390 | TGA | ASTM D3850 | ||
| Scelerisque conductivity | 0.71 | 0.69 | W/m/K | 80℃ | ASTM C518 | |
| Humor, Absorptio Rate | 0.06 | 0.06 | % | 0.060 "exemplaria immersa sunt in aqua ad L° C pro XLVIII horis" | ASTM D570 | |
| Density | 1.79 | 1.86 | gm/cm*3 | 23℃ | ASTM D792 | |
| Cortices fortitudo | 1.056.0） | 0.885.0） | N/mm(pli) | 1 oz.EDC post stagni inficit | IPC.TM.6502.4.8 | |
| Flamma Retardancy | N/A | V0 | UL94 | |||
| Lf amet Compatible | Ita | Ita |
Application Of RO4003C High Frequency PCB
Mobilis communicationis products
Potestas Splitter, coniugator, duplexer, sparguntur et aliae machinis passivae
Potentia Amplifier, Noise Amplifier, etc
Anti-concursus systematis autocineti, systematis satellitum, systematis radiophonicis aliisque campis
Apparatus Propono
PCB Lorem Plating Line
PCB PTH linea
PCB LDI
