computatrum-reparatione Londinensi

VI Stratum HASL Caecus sepultus Via PCB

VI Stratum HASL Caecus sepultus Via PCB

VI Stratum HASL Caecus sepultus via PCB Featured imago
  • VI Stratum HASL Caecus sepultus Via PCB
  • VI Stratum HASL Caecus sepultus Via PCB
  • VI Stratum HASL Caecus sepultus Via PCB
  • VI Stratum HASL Caecus sepultus Via PCB

Description:

Stratis: 6
Superficiem metam: HASL
Basis materia: FR4
Exterior Stratum W/S: 9/4mil
Tegumen interiorem W/S: 11/7mil
Crassitudo: 1.6mm
Min.diametro foramen: 0.3mm


Product Detail

Features Sepulti Via PCB

Processus fabricandi per artem post compagem effici non potest.Singula circa stratis exercendis peragenda sunt.Iacuit interior partim prius religari, deinde curatio electroplatandi, deinde omnia demum religata.Hic processus nonnisi in alta densitate PCBs adhiberi solet ut spatium spatium vacuum aliis circuitibus augere consuevit

The basic process of HDI Caeci Buried Via PCB

1.Cut in materia

2.Inner arida amet

3.Black Oxidation

4.Pressing

5.Drilling

6.Metallization pertusum

7.Second accumsan interiorem aridam film

8.Second lamination (HDI PCB urgeat)

9.Conformalmask

10.Laser diam

11.Metallization laser EXERCITATIO

12.Dry interior film tertio

13.Second laser diam

14.Drilling per foramina

15.PTH

16.Dry film exemplarque plating

17.Wet film (soldmask)

18.Immersiongold

19.C/M excudendi

20.Milling profile

21.Electronic Testis

22.OSP

23.Final recognitionis

24.Packing

Apparatus Propono

5-PCB circuli tabula latae laminae lineae

PCB Lorem Plating Line

PCB tabula lineae circuli PTH productio

PCB PTH linea

15-PCB circuli tabula LDI automatic laser e machina recta intuens

PCB LDI

12-PCB tabula ambitus CCD expositio machinae

PCB CCD Patefacio Machina

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